The redistribution layer (RDL) is an essential component of interposer design. It serves to establish reliable connections between different layers and uphold signal integrity. By utilizing a low-resistance metal like copper, the RDL effectively preserves the integrity of electrical signals and prevents signal attenuation.
Multilayer RDLs are commonly employed to facilitate intricate routing patterns and further enhance signal integrity. These multilayer RDLs consist of stacked metal layers, enabling more complex interconnections. Additionally, folded RDLs are employed to effectively reduce the overall size of the interposer, proving especially beneficial in space-constrained applications.
The incorporation of RDL technology into interposer design brings several advantages:
Improved signal integrity: The implementation of a low-resistance metal within the RDL significantly minimizes signal attenuation, resulting in enhanced overall system performance.
Reduced size: Folded RDLs contribute to the reduction of the interposer’s footprint, proving advantageous in applications where space is limited.
Increased flexibility: The RDL’s versatility in routing electrical signals provides designers with greater flexibility in system architecture, accommodating diverse interconnection requirements.
In conclusion, RDL technology is an invaluable tool for interposer design, offering improvements in signal integrity, size reduction, and system architecture flexibility. By leveraging RDL technology, interposers can deliver enhanced performance, robust connectivity, and optimal utilization in various fields and applications.
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