Design. Fabricate.
Smarter.

Explore microfabrication solutions that grow with your innovation, from early-stage proof to production-ready.

Our Process

From concept to delivery, we ensure every step meets the
highest standards of precision and quality.

Design Review

Comprehensive analysis of
your specifications and
requirements

Prototype & Pilot Runs

Rapid prototyping and
small-scale production
validation

Production

Scalable manufacturing with consistent quality and
precision

Quality & Traceability

Rigorous testing and
complete documentation
throughout the process

Delivery & Support

Timely delivery with ongoing technical support and partnership

Advanced Materials We Work With

We enable innovation across microelectronics, RF, and medtech by offering next-gen materials with unmatched performance characteristics — designed to support early-stage prototyping through low-volume production.

Alumina

Al₂O₃

Stable ceramic with excellent dielectric properties. Great for RF applications up to 30 GHz.

Aluminum Nitride

AlN

RFThermal

High thermal conductivity and RF compatibility — ideal for thermally intensive systems.

Glass

SiO₂

Optical

Ultra-smooth, planar — perfect for interposers, 3D packaging, and microfluidics.

Sapphire

Al₂O₃

MedicalRFOptical

Chemically inert, optically transparent, biocompatible — used in medical + RF builds.

Quartz

SiO₂

Ultra-low dielectric loss and thermal expansion. Suitable for systems beyond 100 GHz.

Diamond

RFThermal

Top-tier thermal management and high-frequency performance. Ideal for power RF designs.

Kapton Film

Medical

Ergonomic, flexible, and lightweight — used in medical imaging.

Silicon

MEMS

A proven base for MEMS, sensor integration, and microfluidic platforms.

Polyimide

Medical

For multilayer medical circuits supports lightweight, ergonomic builds with minimal assembly.

Advanced Materials We Work With

Everything begins with context.

We listen closely to understand what you're building — and where it needs to perform. Every material, tolerance, and process we recommend is grounded in your real-world goals.

Why It Matters:

Matches process + material to end use
Avoids costly rework or delays
Sets you up for success in real conditions

Discovery Questions We Explore:

What’s the core function?
Signal, frequency, or noise sensitivities?
Power + thermal limits?
Rigid, flexible, or hybrid form factor?
Any reliability, safety, or regulatory needs?

Specifications Are Born Here

We don’t guess specs — we define them. From choosing AlN vs. sapphire to dialing in your metal stack, everything flows from clear constraints.

Key Takeaway

Good builds start with great questions.

Why Substrate Choice Matters

Substrates define electrical stability, thermal performance, and fabrication compatibility. A mismatch here compromises everything.

What We Ask

What frequency, loss, or impedance is needed?
Does the design require thermal management?
How important is planarity or surface polish?
Any cost, delivery, or supply constraints?

Specifications

Thickness: 125–500 µm
Edge Clearance: ≥ 75 µm
Surface: Low Ra for high-res patterning

Materials We Work With

Alumina: All-purpose ceramic
AlN: Great thermal conductivity
Quartz: For >100 GHz, ultra-low loss
Glass: Planar and scalable
Sapphire: Biocompatible and RF-capable
Diamond: Ultimate for thermal + RF performance

Key Takeaway

Treat substrates like performance enablers — not just structural platforms.

Why It Matters

Your metal stack isn’t just a technical detail — it’s a performance backbone. From conductivity to corrosion resistance, every layer has a job to do. We tailor each one to your application, not the other way around.

Let’s Think Together

Will you be wire bonding or soldering?
Are you pushing high current or packing tight lines?
Need it to survive harsh conditions or meet biocompatibility?

We’ll ask the right questions and guide material choices accordingly.

What We Often Use

Key Takeaway

There’s no one-stack-fits-all. We’ll build you one that’s just right — for your signals, your process, and your scale-up plan.

Why It Matters

The right vias improve thermal handling, enable 3D routing, and ensure stable RF and power delivery. Poor ones? They compromise everything from signal to yield.

What We'll Ask

Do you need thermal sinks, grounding, or vertical interconnects?
Should the vias be open or filled? With Cu or Au?
How close are features to the edge — and is CMP required?

These answers shape the machining and layout strategy.

Our Go-To Specs

Via Ø ≥ 60% of substrate thickness
Aspect Ratio < 0.6
Pad Ø ≥ 2× via Ø
Post-fill Planarity: ±7 µm
Edge Clearance: ≥100 µm
Include vent holes when filled.

Process Options

Fill: Copper (for thermal), Gold (for corrosion resistance)
Machining: Laser or mechanical — based on material
Polishing: CMP for alumina, soft polish for sapphire

Key Takeaway

Good vias make or break high-density layouts. We help you get them right — structurally, electrically, and thermally.

Why It Matters

Polyimides define how signals are routed, protected, and insulated. The right stack ensures your device handles heat, stress, and scale — especially in RF, medtech, or 3D builds.

What We’ll Explore Together